Product Name: | 2UEW155 Solvent Self-bonding 0.18mm Enameled Copper Wire For Speaker | Thermal Rating: | 155 |
---|---|---|---|
Insulation Material: | Polyurethane | Diameter: | 0.18mm |
Conductor Material: | Copper | Key Word: | 2UEW155 Solvent Self-bonding 0.18mm Enameled Copper Wire For Speaker |
Type: | 2UEW155 Solvent Self-bonding 0.18mm Enameled Copper Wire For Speaker | ||
Highlight: | uew self bonding wire,32 awg self bonding wire,speaker 32 gauge enameled copper wire |
2UEW155 Solvent Self-bonding 0.18mm Enameled Copper Wire for Speaker
0.2mm solvent self-adhesive enameled copper wire: revolutionizing wire applications 0.18mm solvent self-adhesive enameled copper wire is a game changer in electrical wiring. With its unique features and innovative design, this wire offers a wide range of applications and benefits, making it a popular choice among professionals in a variety of industries.
The wire has a slender diameter of 0.18 mm and uses copper conductors coated with a special enameled coating. But what makes it unique is the adhesive layer it has, which allows it to self-adhere. When exposed to alcohol, this adhesive layer is activated, creating a strong and secure bond.
Name |
2UEW155 Solvent Self-bonding 0.18mm Enameled Copper Wire for Speaker |
Key word |
2UEW155 Solvent Self-bonding 0.18mm Enameled Copper Wire for Speaker |
Insulationh |
Enamel |
Thermal rating |
155 |
Diameter of the enameled copper wire |
0.18mm |
Test Item | Unit | Standard Value | Reality Value | ||
Min. | Ave. | Max. | |||
Conductor dimensions | mm | 0.18±0.003 | 0.180 | 0.180 | 0.180 |
(Basecoat dimensions) Overall dimensions |
mm | Max.0.226 | 0.210 | 0.211 | 0.212 |
Insulation Film Thickness | mm | Min. 0.008mm | 0.019 | 0.020 | 0.020 |
Bonding Film Thickness | mm | Min.0.004 | 0.011 | 0.011 | 0.012 |
Continuity of coverin(50V/30m) | Pcs | Max.60 | Max.0 | ||
Flexibility | / | / | |||
Adherence | no crack | Good | |||
Breakdown Voltage | V | Min.2600 | Min.4469 | ||
Resistance to Softening(Cut Through) |
℃ | Continue 2 times pass | 300℃/Good | ||
(390℃±5℃)Solder test |
s | / | / | ||
Bonding Strength | g | Min. 29.4 | 50 | ||
Electrical Resistance(20℃) | Ω/m | Max.715.0 | 679 | 680 | 681 |
Elongation | % | Min.15 | 29 | 30 | 30 |
Breaking Load | N | Min | / | / | / |
Surface appearance | Smooth | Good |