Product Name: | OCC 4N 5N 6N High Purity Bare Copper Wire Enameled Copper Wire | Thermal Rating: | 155 |
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Insulation Material: | Enamel | Diameter: | 0.15mm |
Conductor Material: | Copper | Key Word: | OCC 4N 5N 6N High Purity Bare Copper Wire Enameled Copper Wire |
Highlight: | 5N Bare Copper Wire,4N Bare Copper Wire,6N Bare Copper Wire |
OCC 4N 5N 6N High Purity Bare Copper Wire Enameled Copper Wire
Annealing is a process that solely focuses on stress relief without modifying the number of single crystal copper crystals. It is drawing that can cause changes in crystal morphology and potentially lead to crystal fragmentation. Understanding these differences is vital for the proper handling and utilization of single crystal copper materials in various industrial applications. Manufacturers and researchers need to carefully consider the appropriate processing methods based on the specific requirements of the end products. Whether it is to maintain the integrity of the single crystal structure or to achieve a desired crystal shape and size, a comprehensive understanding of the effects of annealing and drawing is indispensable in the field of single crystal copper material processing.
Mechanical Properties of Single crystal Copper vs. Polycrystalline Copper |
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Sample |
Tensile strength(Mpa) |
Yield strength(Mpa) |
Elongation(%) |
Vickers hardness(HV) |
Reduction of area(%) |
Single crystal Copper |
128.31 |
83.23 |
48.32 |
65 |
55.56 |
OFC Copper |
151.89 |
121.37 |
26 |
79 |
41.22 |
Production process
Multi-scenario application
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