Product Name: | Ultrafine Round Enameled Copper Wire For Microelectronics | Thermal Rating: | 155 |
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Insulation Material: | UEW | Diameter: | 0.045mm |
Conductor Material: | Copper | Key Word: | Ultrafine Round Enameled Copper Wire For Microelectronics |
Highlight: | Microelectronics Enameled Copper Wire,Round Enameled Copper Wire,Ultrafine Enamelled Copper Wire |
Ultrafine Round Enameled Copper Wire For Microelectronics
In the field of microelectronics, enameled copper wire is commonly used to make miniature transformers, inductors, inductors and other electronic components. It is widely used in various miniature electronic devices and circuits, such as mobile phones, tablets, computers and other consumer electronics. Its high electrical conductivity and heat resistance make it one of the important materials in the field of microelectronics.
Test Items | Requirements | Test Data | ||
1st Sample | 2nd Sample | 3rd Sample | ||
Appearance | Smooth & Clean | OK | OK | OK |
Conductor Diameter | 0.045mm ±0.001mm | 0.0450 | 0.0450 | 0.0450 |
Thickness of Insulation | ≥ 0.006 mm | 0.0090 | 0.0080 | 0.0090 |
Overall Diameter | ≤ 0.056 mm | 0.0540 | 0.0530 | 0.0540 |
DC Resistance | ≤ 11.339 Ω/m | 10.740 | 10.698 | 10.743 |
Elongation | ≥ 11% | 22 | 20 | 21 |
Breakdown Voltage | ≥350 V | 1764 | 1567 | 1452 |
Pin Hole | ≤ 5(faults)/5m | 0 | 0 | 0 |
Adherence | No cracks visible | OK | OK | OK |
Cut-through | 200℃ 2min No breakdown | OK | OK | OK |
Heat Shock | 175±5℃/30min No cracks | OK | OK | OK |
Solderability | 390± 5℃ 2 Sec No slags | OK | OK | OK |
Product |
Ultrafine Round Enameled Copper Wire For Microelectronics |
Key word |
Ultrafine Round Enameled Copper Wire For Microelectronics |